The global Electronic Adhesives Market Study analyzes and forecasts the market size across 6 regions and 24 countries for diverse segments -By Resin (Epoxy, Silicone, Polyurethane (PU), Acrylic, Others), By Form (Liquid, Paste, Solid), By Product (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Others), By End-User (Computers, Communications, Consumer Electronics, Others).
In 2024, the electronic adhesives market s to experience significant growth, fueled by the rapid evolution of electronic devices and the demand for high-performance bonding solutions. Electronic adhesives play a crucial role in assembling and packaging electronic components, providing structural support, thermal management, and electrical conductivity. With the ongoing miniaturization trend in electronics and the increasing complexity of device designs, there's a growing need for adhesives capable of bonding delicate components while withstanding harsh operating conditions. This has led to the development of specialized electronic adhesives tailored to the requirements of different applications, including surface mount technology (SMT), semiconductor packaging, and display manufacturing. Further, the proliferation of wearable devices, IoT sensors, and flexible electronics has expanded the application scope of electronic adhesives, driving demand for formulations compatible with diverse substrates and manufacturing processes. Additionally, advancements in adhesive chemistry, such as the introduction of low-temperature curing adhesives and conductive adhesives, are enabling new possibilities in electronic packaging and interconnection. Furthermore, the increasing focus on sustainability and regulatory compliance is driving the adoption of eco-friendly electronic adhesives with reduced volatile organic compound (VOC) emissions and hazardous substances, aligning with the broader push towards greener manufacturing practices.
The market report analyses the leading companies in the industry including 3M Company, Altana AG, Arkema SA, Atom Adhesives, Bondline Electronic Adhesives Inc, Boyd Corp, Delo Industrie Klebstoffe GmbH & Co. KGaA, Dymax Corp, Element Solutions Inc, H.B. Fuller Company, Henkel AG, Huntsman International LLC, LG Chemical Ltd, Master Bond Inc, Meridian Adhesives Group, Momentive Performance Materials Inc, Panacol-Elosol GmbH, Panasonic Corp, Parker Hannifin Corp, Permabond LLC, Rogers Corp, Scapa Group Plc, Sika AG, The Dow Chemical Company, Threebond Co. Ltd, Wacker Chemie, Xiamen Weldbond New Material Co. Ltd, and others.
In the market for electronic adhesives, a prominent trend is the miniaturization and increased functionality of electronic devices. As consumer electronics, automotive electronics, and medical devices continue to evolve, there is a growing demand for adhesives that can bond smaller and more intricate components while providing excellent electrical conductivity, thermal management, and reliability. This trend is driven by factors such as the proliferation of wearable technology, IoT devices, and smart appliances, which require adhesives capable of withstanding harsh environmental conditions, vibration, and thermal cycling. Additionally, advancements in semiconductor packaging, flexible circuitry, and 3D printing technologies are pushing the boundaries of electronic design, creating opportunities for electronic adhesive manufacturers to innovate and develop specialized adhesive formulations that meet the unique requirements of next-generation electronic devices. As industries strive to make devices smaller, lighter, and more feature-rich, the demand for electronic adhesives that enable precise assembly, robust performance, and long-term durability is expected to continue growing.
A significant driver propelling the market for electronic adhesives is the demand for high-performance bonding solutions across various industries. Electronic adhesives play a critical role in assembling and protecting electronic components, providing structural integrity, thermal management, electrical conductivity, and environmental protection. The driver is fueled by factors such as the increasing complexity and functionality of electronic devices, the need for miniaturization and lightweighting, and the requirement for adhesives that offer excellent adhesion to diverse substrates including metals, plastics, ceramics, and composites. Additionally, industries such as automotive, aerospace, and medical devices require electronic adhesives that meet stringent performance standards, regulatory requirements, and reliability specifications. As manufacturers seek to enhance product performance, reduce assembly costs, and accelerate time-to-market, the demand for electronic adhesives that offer superior bonding strength, thermal stability, and chemical resistance is expected to grow. This creates opportunities for adhesive manufacturers to collaborate with electronics OEMs, contract manufacturers, and material suppliers to develop customized adhesive solutions that address specific application needs and deliver value-added performance benefits.
An opportunity within the market for electronic adhesives lies in the development of next-generation adhesive technologies tailored to the evolving needs of electronic device manufacturers. Opportunities exist to innovate and optimize adhesive formulations for emerging applications such as flexible electronics, 5G infrastructure, electric vehicles, and wearable devices, where adhesives play a critical role in enabling advanced functionalities and performance features. Advanced adhesive technologies, including conductive adhesives, thermal interface materials, UV-curable adhesives, and low-outgassing formulations, can address challenges related to miniaturization, high-speed data transmission, thermal management, and reliability in electronic assemblies. Furthermore, opportunities exist to develop environmentally friendly and sustainable adhesive formulations that minimize the use of hazardous substances and comply with regulatory standards. By offering next-generation electronic adhesive technologies that meet the evolving demands of electronic device manufacturers, adhesive manufacturers can differentiate their products, strengthen customer relationships, and capture opportunities in the rapidly evolving electronics market. Collaboration with industry partners, research institutions, and technology providers can facilitate the development and commercialization of innovative adhesive solutions that enable the next generation of electronic devices and systems. This opportunity aligns with the market's evolution towards innovation, performance optimization, and sustainability, addressing the demand for advanced materials and technologies in the electronics industry's continuous quest for miniaturization, connectivity, and functionality.
The Epoxy segment is the largest segment in the Electronic Adhesives Market due to its versatile properties and wide-ranging applications in electronic device assembly. Epoxy adhesives offer excellent adhesion to various substrates commonly used in electronics manufacturing, including metals, plastics, and ceramics. They provide strong bonds, high thermal and chemical resistance, and exceptional electrical insulation properties, making them ideal for bonding components in electronic devices such as printed circuit boards (PCBs), semiconductor chips, sensors, and displays. Additionally, epoxy adhesives are available in different formulations to meet specific requirements, such as fast curing, low outgassing, and compatibility with different manufacturing processes like surface mount technology (SMT) and encapsulation. The reliability and performance of epoxy adhesives have made them a preferred choice in the electronics industry, driving their widespread adoption and dominance in the Electronic Adhesives Market. Therefore, propelled by their superior properties and versatility, the Epoxy segment maintains its position as the largest segment in the Electronic Adhesives Market.
The Liquid segment is the fastest-growing segment in the Electronic Adhesives Market due to its versatility and suitability for a wide range of electronic assembly applications. Liquid adhesives offer potential advantages over other forms such as paste or solid adhesives. They provide excellent wetting properties, enabling them to form intimate contact with the surfaces of electronic components, ensuring strong and reliable bonds. Liquid adhesives also offer the advantage of easy dispensing and conformability, allowing for precise application even in intricate and miniaturized electronic assemblies. Moreover, liquid adhesives often exhibit faster curing times compared to solid adhesives, reducing assembly cycle times and increasing manufacturing efficiency. With the growing demand for electronic devices with smaller form factors, higher performance, and enhanced reliability, the need for liquid adhesives that can meet these stringent requirements is escalating rapidly. As a result, the Liquid segment experiences robust growth in the Electronic Adhesives Market, driven by its superior performance, ease of use, and suitability for modern electronic manufacturing processes. Therefore, propelled by the increasing adoption of liquid adhesives in electronic device assembly, the Liquid segment is the fastest-growing segment in the Electronic Adhesives Market.
The Electrically Conductive Adhesives segment is the largest segment in the Electronic Adhesives Market due to its critical role in modern electronic device manufacturing. Electrically conductive adhesives (ECAs) are specifically formulated to provide both adhesive bonding and electrical conductivity, making them essential for various applications where electrical connections are required. ECAs offer advantages over traditional soldering methods, including the ability to bond dissimilar materials, accommodate thermal expansion differences, and create reliable and flexible electrical connections. These adhesives find extensive use in the assembly of electronic components such as surface-mounted devices (SMDs), printed circuit boards (PCBs), and semiconductor packages. Moreover, as electronic devices become increasingly miniaturized and complex, the demand for electrically conductive adhesives that can deliver precise and reliable electrical connections while meeting stringent performance requirements continues to rise. Therefore, driven by their indispensable role in modern electronics manufacturing and the growing demand for advanced electronic devices, the Electrically Conductive Adhesives segment maintains its position as the largest segment in the Electronic Adhesives Market.
The Consumer Electronics segment is the fastest-growing segment in the Electronic Adhesives Market due to the rapid evolution and expansion of the consumer electronics industry worldwide. With the proliferation of smartphones, tablets, wearables, smart home devices, and other consumer gadgets, there is an increasing demand for advanced electronic adhesives to support the assembly of these products. Electronic adhesives play a crucial role in bonding components within consumer electronics, ensuring structural integrity, electrical connectivity, and overall device performance. Moreover, as consumer electronics continue to become more compact, lightweight, and feature-rich, the requirements for electronic adhesives become more demanding. These adhesives must offer properties such as high strength, thermal stability, resistance to moisture and environmental factors, and compatibility with various substrates. As consumer preferences drive the demand for sleeker designs, improved functionality, and enhanced durability in electronic devices, the Consumer Electronics segment experiences significant growth in the Electronic Adhesives Market. Therefore, propelled by the relentless innovation and expansion in the consumer electronics sector, the Consumer Electronics segment is the fastest-growing segment in the Electronic Adhesives Market.
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
Countries Analyzed
North America (US, Canada, Mexico)
Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe)
Asia Pacific (China, India, Japan, South Korea, Australia, South East Asia, Rest of Asia)
South America (Brazil, Argentina, Rest of South America)
Middle East and Africa (Saudi Arabia, UAE, Rest of Middle East, South Africa, Egypt, Rest of Africa)
3M Company
Altana AG
Arkema SA
Atom Adhesives
Bondline Electronic Adhesives Inc
Boyd Corp
Delo Industrie Klebstoffe GmbH & Co. KGaA
Dymax Corp
Element Solutions Inc
H.B. Fuller Company
Henkel AG
Huntsman International LLC
LG Chemical Ltd
Master Bond Inc
Meridian Adhesives Group
Momentive Performance Materials Inc
Panacol-Elosol GmbH
Panasonic Corp
Parker Hannifin Corp
Permabond LLC
Rogers Corp
Scapa Group Plc
Sika AG
The Dow Chemical Company
Threebond Co. Ltd
Wacker Chemie
Xiamen Weldbond New Material Co. Ltd
*- List Not Exhaustive
TABLE OF CONTENTS
1 Introduction to 2024 Electronic Adhesives Market
1.1 Market Overview
1.2 Quick Facts
1.3 Scope/Objective of the Study
1.4 Market Definition
1.5 Countries and Regions Covered
1.6 Units, Currency, and Conversions
1.7 Industry Value Chain
2 Research Methodology
2.1 Market Size Estimation
2.2 Sources and Research Methodology
2.3 Data Triangulation
2.4 Assumptions and Limitations
3 Executive Summary
3.1 Global Electronic Adhesives Market Size Outlook, $ Million, 2021 to 2032
3.2 Electronic Adhesives Market Outlook by Type, $ Million, 2021 to 2032
3.3 Electronic Adhesives Market Outlook by Product, $ Million, 2021 to 2032
3.4 Electronic Adhesives Market Outlook by Application, $ Million, 2021 to 2032
3.5 Electronic Adhesives Market Outlook by Key Countries, $ Million, 2021 to 2032
4 Market Dynamics
4.1 Key Driving Forces of Electronic Adhesives Industry
4.2 Key Market Trends in Electronic Adhesives Industry
4.3 Potential Opportunities in Electronic Adhesives Industry
4.4 Key Challenges in Electronic Adhesives Industry
5 Market Factor Analysis
5.1 Value Chain Analysis
5.2 Competitive Landscape
5.2.1 Global Electronic Adhesives Market Share by Company (%), 2023
5.2.2 Product Offerings by Company
5.3 Porter’s Five Forces Analysis
5.4 Pricing Analysis and Outlook
6 Growth Outlook Across Scenarios
6.1 Growth Analysis-Case Scenario Definitions
6.2 Low Growth Scenario Forecasts
6.3 Reference Growth Scenario Forecasts
6.4 High Growth Scenario Forecasts
7 Global Electronic Adhesives Market Outlook by Segments
7.1 Electronic Adhesives Market Outlook by Segments, $ Million, 2021- 2032
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
8 North America Electronic Adhesives Market Analysis and Outlook To 2032
8.1 Introduction to North America Electronic Adhesives Markets in 2024
8.2 North America Electronic Adhesives Market Size Outlook by Country, 2021-2032
8.2.1 United States
8.2.2 Canada
8.2.3 Mexico
8.3 North America Electronic Adhesives Market size Outlook by Segments, 2021-2032
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
9 Europe Electronic Adhesives Market Analysis and Outlook To 2032
9.1 Introduction to Europe Electronic Adhesives Markets in 2024
9.2 Europe Electronic Adhesives Market Size Outlook by Country, 2021-2032
9.2.1 Germany
9.2.2 France
9.2.3 Spain
9.2.4 United Kingdom
9.2.4 Italy
9.2.5 Russia
9.2.6 Norway
9.2.7 Rest of Europe
9.3 Europe Electronic Adhesives Market Size Outlook by Segments, 2021-2032
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
10 Asia Pacific Electronic Adhesives Market Analysis and Outlook To 2032
10.1 Introduction to Asia Pacific Electronic Adhesives Markets in 2024
10.2 Asia Pacific Electronic Adhesives Market Size Outlook by Country, 2021-2032
10.2.1 China
10.2.2 India
10.2.3 Japan
10.2.4 South Korea
10.2.5 Indonesia
10.2.6 Malaysia
10.2.7 Australia
10.2.8 Rest of Asia Pacific
10.3 Asia Pacific Electronic Adhesives Market size Outlook by Segments, 2021-2032
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
11 South America Electronic Adhesives Market Analysis and Outlook To 2032
11.1 Introduction to South America Electronic Adhesives Markets in 2024
11.2 South America Electronic Adhesives Market Size Outlook by Country, 2021-2032
11.2.1 Brazil
11.2.2 Argentina
11.2.3 Rest of South America
11.3 South America Electronic Adhesives Market size Outlook by Segments, 2021-2032
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
12 Middle East and Africa Electronic Adhesives Market Analysis and Outlook To 2032
12.1 Introduction to Middle East and Africa Electronic Adhesives Markets in 2024
12.2 Middle East and Africa Electronic Adhesives Market Size Outlook by Country, 2021-2032
12.2.1 Saudi Arabia
12.2.2 UAE
12.2.3 Oman
12.2.4 Rest of Middle East
12.2.5 Egypt
12.2.6 Nigeria
12.2.7 South Africa
12.2.8 Rest of Africa
12.3 Middle East and Africa Electronic Adhesives Market size Outlook by Segments, 2021-2032
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
13 Company Profiles
13.1 Company Snapshot
13.2 SWOT Profiles
13.3 Products and Services
13.4 Recent Developments
13.5 Financial Profile
3M Company
Altana AG
Arkema SA
Atom Adhesives
Bondline Electronic Adhesives Inc
Boyd Corp
Delo Industrie Klebstoffe GmbH & Co. KGaA
Dymax Corp
Element Solutions Inc
H.B. Fuller Company
Henkel AG
Huntsman International LLC
LG Chemical Ltd
Master Bond Inc
Meridian Adhesives Group
Momentive Performance Materials Inc
Panacol-Elosol GmbH
Panasonic Corp
Parker Hannifin Corp
Permabond LLC
Rogers Corp
Scapa Group Plc
Sika AG
The Dow Chemical Company
Threebond Co. Ltd
Wacker Chemie
Xiamen Weldbond New Material Co. Ltd
14 Appendix
14.1 Customization Offerings
14.2 Subscription Services
14.3 Related Reports
14.4 Publisher Expertise
By Resin
Epoxy
Silicone
Polyurethane (PU)
Acrylic
Others
By Form
Liquid
Paste
Solid
By Product
Electrically Conductive Adhesives
Thermally Conductive Adhesives
Others
By End-User
Computers
Communications
Consumer Electronics
Others
Countries Analyzed
North America (US, Canada, Mexico)
Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe)
Asia Pacific (China, India, Japan, South Korea, Australia, South East Asia, Rest of Asia)
South America (Brazil, Argentina, Rest of South America)
Middle East and Africa (Saudi Arabia, UAE, Rest of Middle East, South Africa, Egypt, Rest of Africa)
Global Electronic Adhesives Market Size is valued at $5.1 Billion in 2024 and is forecast to register a growth rate (CAGR) of 6.1% to reach $8.2 Billion by 2032.
Emerging Markets across Asia Pacific, Europe, and Americas present robust growth prospects.
3M Company, Altana AG, Arkema SA, Atom Adhesives, Bondline Electronic Adhesives Inc, Boyd Corp, Delo Industrie Klebstoffe GmbH & Co. KGaA, Dymax Corp, Element Solutions Inc, H.B. Fuller Company, Henkel AG, Huntsman International LLC, LG Chemical Ltd, Master Bond Inc, Meridian Adhesives Group, Momentive Performance Materials Inc, Panacol-Elosol GmbH, Panasonic Corp, Parker Hannifin Corp, Permabond LLC, Rogers Corp, Scapa Group Plc, Sika AG, The Dow Chemical Company, Threebond Co. Ltd, Wacker Chemie, Xiamen Weldbond New Material Co. Ltd
Base Year- 2023; Estimated Year- 2024; Historic Period- 2018-2023; Forecast period- 2024 to 2032; Currency: Revenue (USD); Volume